Issued Patents 2019
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510829 | Secondary use of aspect ratio trapping trenches as resistor structures | Alexander Reznicek, Chih-Chao Yang, Praneet Adusumilli | 2019-12-17 |
| 10461148 | Multilayer buried metal-insultor-metal capacitor structures | Alexander Reznicek, Joshua M. Rubin, Praneet Adusumilli | 2019-10-29 |
| 10446746 | ReRAM structure formed by a single process | Alexander Reznicek, Adra Carr, Praneet Adusumilli | 2019-10-15 |
| 10431542 | Low resistance seed enhancement spacers for voidless interconnect structures | Praneet Adusumilli, Joseph F. Maniscalco, Alexander Reznicek | 2019-10-01 |
| 10411109 | Bipolar junction transistor (BJT) for liquid flow biosensing applications without a reference electrode and large sensing area | Alexander Reznicek, Tak H. Ning, Sufi Zafar | 2019-09-10 |
| 10410966 | BEOL embedded high density vertical resistor structure | Alexander Reznicek, Praneet Adusumilli | 2019-09-10 |
| 10396165 | Thin low defect relaxed silicon germanium layers on bulk silicon substrates | Praneet Adusumilli, Keith E. Fogel, Alexander Reznicek | 2019-08-27 |
| 10388721 | Conformal capacitor structure formed by a single process | Praneet Adusumilli, Alexander Reznicek | 2019-08-20 |
| 10388600 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Praneet Adusumilli, Koichi Motoyama | 2019-08-20 |
| 10361277 | Low resistivity wrap-around contacts | Praneet Adusumilli, Adra Carr, Alexander Reznicek | 2019-07-23 |
| 10355094 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-07-16 |
| 10340221 | Stacked FinFET anti-fuse | Alexander Reznicek, Praneet Adusumilli, Keith E. Fogel | 2019-07-02 |
| 10340355 | Method of forming a dual metal interconnect structure | Praneet Adusumilli, Hemanth Jagannathan, Koichi Motoyama | 2019-07-02 |
| 10312097 | Salicide bottom contacts | Praneet Adusumilli, Alexander Reznicek | 2019-06-04 |
| 10304841 | Metal FinFET anti-fuse | Praneet Adusumilli, Alexander Reznicek, Miaomiao Wang, Chih-Chao Yang | 2019-05-28 |
| 10304773 | Low resistance contact structures including a copper fill for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-05-28 |
| 10269710 | Multi-level metallization interconnect structure | Praneet Adusumilli, Alexander Reznicek | 2019-04-23 |
| 10269698 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Praneet Adusumilli, Koichi Motoyama | 2019-04-23 |
| 10249501 | Single process for liner and metal fill | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-04-02 |
| 10249724 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-04-02 |
| 10224281 | Metallic blocking layer for reliable interconnects and contacts | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-03-05 |
| 10211095 | High performance middle of line interconnects | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-02-19 |
| 10170360 | Reflow enhancement layer for metallization structures | Praneet Adusumilli, Alexander Reznicek | 2019-01-01 |
| 10170423 | Metal cap integration by local alloying | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-01-01 |
| 10170419 | Biconvex low resistance metal wire | Praneet Adusumilli, Alexander Reznicek | 2019-01-01 |