Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468346 | Advanced interconnects containing an IMT liner | Andrew Tae Kim, Baozhen Li, Chih-Chao Yang | 2019-11-05 |
| 10431542 | Low resistance seed enhancement spacers for voidless interconnect structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-10-01 |