Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468346 | Advanced interconnects containing an IMT liner | Joseph F. Maniscalco, Baozhen Li, Chih-Chao Yang | 2019-11-05 |
| 10325862 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang | 2019-06-18 |
| 10304783 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Chengwen Pei, Ping-Chuan Wang | 2019-05-28 |
| 10262934 | Three plate MIM capacitor via integrity verification | Baozhen Li, Barry P. Linder, Ernest Y. Wu | 2019-04-16 |
| 10229873 | Three plate MIM capacitor via integrity verification | Baozhen Li, Barry P. Linder, Ernest Y. Wu | 2019-03-12 |