Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403772 | Electrical and optical via connections on a same chip | Juntao Li, Kangguo Cheng, Geng Wang, Joseph Ervin | 2019-09-03 |
| 10304783 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang | 2019-05-28 |
| 10290574 | Embedded metal-insulator-metal (MIM) decoupling capacitor in monolitic three-dimensional (3D) integrated circuit (IC) structure | Geng Wang, Kangguo Cheng, Juntao Li | 2019-05-14 |
| 10224418 | Integrated circuit fabrication with boron etch-stop layer | Xusheng Wu, Ziyan Xu | 2019-03-05 |
| 10224334 | Anti-fuse with reduced programming voltage | Kangguo Cheng, Juntao Li, Geng Wang | 2019-03-05 |
| 10199463 | Nanowire-based vertical memory cell array having a metal layer interposed between a common back plate and the nanowires | Waikin Li, Ping-Chuan Wang | 2019-02-05 |
| 10181468 | Memory cell with asymmetrical transistor, asymmetrical transistor and method of forming | Ziyan Xu, Xusheng Wu | 2019-01-15 |