Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438890 | Interconnect structure having power rail structure and related method | Atsushi Ogino | 2019-10-08 |
| 10388617 | Mechanically anchored C4 pad and method of forming same | Ping-Chuan Wang, Ronald G. Filippi | 2019-08-20 |
| 10325862 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang | 2019-06-18 |
| 10304783 | Wafer reinforcement to reduce wafer curvature | Andrew Tae Kim, Chengwen Pei, Ping-Chuan Wang | 2019-05-28 |
| 10297546 | Interconnect structures for a security application | Ronald G. Filippi, Ping-Chuan Wang, Cathryn J. Christiansen | 2019-05-21 |