Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438890 | Interconnect structure having power rail structure and related method | Erdem Kaltalioglu | 2019-10-08 |
| 10403574 | Method to reduce resistance for a copper (Cu) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom | Jim Shih-Chun Liang, Justin C. Long | 2019-09-03 |
| 10395980 | Dual airgap structure | Motoi Ichihashi | 2019-08-27 |
| 10229918 | Methods of forming semiconductor devices using semi-bidirectional patterning | — | 2019-03-12 |