Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490501 | Method to form interconnect structure with tungsten fill | Keith Kwong Hon Wong | 2019-11-26 |
| 10403574 | Method to reduce resistance for a copper (Cu) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom | Atsushi Ogino, Justin C. Long | 2019-09-03 |
| 10354918 | Contact element structure of a semiconductor device | — | 2019-07-16 |
| 10347529 | Interconnect structures | Keith Kwong Hon Wong | 2019-07-09 |
| 10249534 | Method of forming a contact element of a semiconductor device and contact element structure | — | 2019-04-02 |