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Advanced crack stop structure |
Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla |
2019-11-26 |
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Advanced crack stop structure |
Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla |
2019-11-12 |
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Low resistance contact for transistors |
Lawrence A. Clevenger, Junli Wang, Kirk D. Peterson, Terry A. Spooner, John E. Sheets, II |
2019-11-05 |
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Advanced interconnects containing an IMT liner |
Joseph F. Maniscalco, Andrew Tae Kim, Chih-Chao Yang |
2019-11-05 |
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Enhancement of iso-via reliability |
Lawrence A. Clevenger, Xiao Hu Liu, Kirk D. Peterson |
2019-10-29 |
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Semiconductor via structure with lower electrical resistance |
Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang |
2019-10-29 |
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Dielectric crack stop for advanced interconnects |
Chih-Chao Yang, Griselda Bonilla |
2019-08-27 |
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Precision BEOL resistors |
Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang |
2019-07-23 |
| 10340330 |
Precision BEOL resistors |
Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang |
2019-07-02 |
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Precision beol resistors |
Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang |
2019-06-25 |
| 10332955 |
Precision BEOL resistors |
Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang |
2019-06-25 |
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Three plate MIM capacitor via integrity verification |
Andrew Tae Kim, Barry P. Linder, Ernest Y. Wu |
2019-04-16 |
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Semiconductor device and method of forming the semiconductor device |
Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang |
2019-04-09 |
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Three plate MIM capacitor via integrity verification |
Andrew Tae Kim, Barry P. Linder, Ernest Y. Wu |
2019-03-12 |
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Methodology to prevent metal lines from current pulse damage |
Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder |
2019-02-26 |