Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388600 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Praneet Adusumilli | 2019-08-20 |
| 10361119 | Enlarged contact area structure using noble metal cap and noble metal liner | Chih-Chao Yang, James J. Kelly, Cornelius Brown Peethala | 2019-07-23 |
| 10340355 | Method of forming a dual metal interconnect structure | Praneet Adusumilli, Hemanth Jagannathan, Oscar van der Straten | 2019-07-02 |
| 10269698 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Praneet Adusumilli | 2019-04-23 |
| 10217664 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Wei Wang, Chih-Chao Yang | 2019-02-26 |
| 10211101 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Wei Wang, Chih-Chao Yang | 2019-02-19 |
| 10204828 | Enabling low resistance gates and contacts integrated with bilayer dielectrics | Ruqiang Bao, Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo +1 more | 2019-02-12 |