Issued Patents 2019
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515894 | Enhanced self-alignment of vias for a semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Nicole Saulnier | 2019-12-24 |
| 10515903 | Selective CVD alignment-mark topography assist for non-volatile memory | Chih-Chao Yang, Lawrence A. Clevenger, Benjamin D. Briggs | 2019-12-24 |
| 10492019 | Binaural audio calibration | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins | 2019-11-26 |
| 10461248 | Bottom electrode for MRAM applications | Prasad Bhosale, Raghuveer R. Patlolla, Chih-Chao Yang | 2019-10-29 |
| 10446496 | Self-forming barrier for cobalt interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami | 2019-10-15 |
| 10431116 | Orator effectiveness through real-time feedback system with automatic detection of human behavioral and emotional states of orator and audience | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2019-10-01 |
| 10431544 | Self-forming barrier for cobalt interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami | 2019-10-01 |
| 10424456 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Lawrence A. Clevenger | 2019-09-24 |
| 10404306 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2019-09-03 |
| 10395986 | Fully aligned via employing selective metal deposition | Benjamin D. Briggs, James J. Kelly, Donald F. Canaperi, Lawrence A. Clevenger | 2019-08-27 |
| 10395977 | Self aligned via and pillar cut for at least a self aligned double pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert | 2019-08-27 |
| 10388525 | Multi-angled deposition and masking for custom spacer trim and selected spacer removal | Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Christopher J. Penny | 2019-08-20 |
| 10381563 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Lawrence A. Clevenger, Shyng-Tsong Chen | 2019-08-13 |
| 10366952 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2019-07-30 |
| 10366920 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2019-07-30 |
| 10361079 | Multi-angled deposition and masking for custom spacer trim and selected spacer removal | Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Christopher J. Penny | 2019-07-23 |
| 10361117 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2019-07-23 |
| 10361157 | Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny | 2019-07-23 |
| 10361364 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Chih-Chao Yang | 2019-07-23 |
| 10347825 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Joe Lee, Christopher J. Penny, Chih-Chao Yang | 2019-07-09 |
| 10319783 | Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects | Benjamin D. Briggs, Theodorus E. Standaert | 2019-06-11 |
| 10315451 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2019-06-11 |
| 10312434 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Joe Lee, Christopher J. Penny, Chih-Chao Yang | 2019-06-04 |
| 10303829 | Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance | Prasad Bhosale, Chih-Chao Yang | 2019-05-28 |
| 10297750 | Wraparound top electrode line for crossbar array resistive switching device | Takashi Ando, Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2019-05-21 |