Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490481 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10490480 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10468585 | Dual function magnetic tunnel junction pillar encapsulation | Son V. Nguyen, Alexander Reznicek | 2019-11-05 |
| 10395986 | Fully aligned via employing selective metal deposition | Benjamin D. Briggs, James J. Kelly, Michael Rizzolo, Lawrence A. Clevenger | 2019-08-27 |
| 10366928 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Zhenxing Bi, Thamarai S. Devarajan, Sivananda K. Kanakasabapathy, Fee Li Lie, Peng Xu | 2019-07-30 |
| 10242882 | Cyclic etch process to remove dummy gate oxide layer for fin field effect transistor fabrication | Zhenxing Bi, Thamarai S. Devarajan, Sean Teehan | 2019-03-26 |
| 10242872 | Rework of patterned dielectric and metal hardmask films | John C. Arnold, Prasad Bhosale, Raghuveer R. Patlolla, Cornelius Brown Peethala, Hosadurga Shobha +1 more | 2019-03-26 |
| 10224283 | Composite manganese nitride / low-k dielectric cap | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2019-03-05 |