Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490480 | Copper microcooler structure and fabrication | Fee Li Lie, Donald F. Canaperi, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10490481 | Copper microcooler structure and fabrication | Fee Li Lie, Donald F. Canaperi, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10424527 | Electronic package with tapered pedestal | Hilton T. Toy, Krishna R. Tunga, Thomas Weiss | 2019-09-24 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Hilton T. Toy, Jeffrey A. Zitz | 2019-06-25 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2019-01-01 |