Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424494 | Chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2019-09-24 |
| 10424527 | Electronic package with tapered pedestal | Kamal K. Sikka, Krishna R. Tunga, Thomas Weiss | 2019-09-24 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2019-06-25 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2019-01-01 |