YP

Yi Pan

IBM: 1 patents #5,496 of 11,143Top 50%
📍 Poughkeepsie, NY: #167 of 263 inventorsTop 65%
🗺 New York: #5,008 of 13,137 inventorsTop 40%
Overall (2019): #213,241 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10424494 Chip module with stiffening frame and orthogonal heat spreader Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz 2019-09-24