Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461248 | Bottom electrode for MRAM applications | Prasad Bhosale, Michael Rizzolo, Chih-Chao Yang | 2019-10-29 |
| 10373867 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Cornelius Brown Peethala, Chih-Chao Yang | 2019-08-06 |
| 10373909 | Selective surface modification of interconnect structures | Cornelius Brown Peethala, Roger A. Quon, Chih-Chao Yang | 2019-08-06 |
| 10242872 | Rework of patterned dielectric and metal hardmask films | John C. Arnold, Prasad Bhosale, Donald F. Canaperi, Cornelius Brown Peethala, Hosadurga Shobha +1 more | 2019-03-26 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang | 2019-02-19 |
| 10204829 | Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers | Hari Prasad Amanapu, Cornelius Brown Peethala, Chih-Chao Yang, Takeshi Nogami | 2019-02-12 |
| 10177030 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Cornelius Brown Peethala, Chih-Chao Yang | 2019-01-08 |