Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242909 | Wet etch removal of Ru selective to other metals | Benjamin D. Briggs, Cornelius Brown Peethala | 2019-03-26 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2019-02-19 |
| 10204856 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta | 2019-02-12 |
| 10170644 | Processes for uniform metal semiconductor alloy formation for front side contact metallization and photovoltaic device formed therefrom | Kathryn C. Fisher, Qiang Huang, Satyavolu S. Papa Rao | 2019-01-01 |