| 10396013 |
Advanced through substrate via metallization in three dimensional semiconductor integration |
Chih-Chao Yang |
2019-08-27 |
| 10396012 |
Advanced through substrate via metallization in three dimensional semiconductor integration |
Chih-Chao Yang |
2019-08-27 |
| 10325806 |
Copper interconnect structure with manganese oxide barrier layer |
Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha |
2019-06-18 |
| 10325978 |
Resistors with controlled resistivity |
Chih-Chao Yang |
2019-06-18 |
| 10312181 |
Advanced through substrate via metallization in three dimensional semiconductor integration |
Chih-Chao Yang |
2019-06-04 |
| 10297569 |
Method of forming a three-dimensional bonded semiconductor structure having nitridized oxide regions |
Chih-Chao Yang |
2019-05-21 |
| 10283583 |
3D resistor structure with controlled resistivity |
Chih-Chao Yang |
2019-05-07 |
| 10276435 |
Advanced copper interconnects with hybrid microstructure |
Chih-Chao Yang |
2019-04-30 |
| 10276649 |
Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers |
Chih-Chao Yang |
2019-04-30 |
| 10276501 |
Formation of liner and metal conductor |
Chih-Chao Yang |
2019-04-30 |
| 10249703 |
Metal resistors having nitridized metal surface layers with different nitrogen content |
Chih-Chao Yang |
2019-04-02 |
| 10249702 |
Metal resistors having varying resistivity |
Chih-Chao Yang |
2019-04-02 |
| 10236257 |
Cobalt top layer advanced metallization for interconnects |
Chih-Chao Yang |
2019-03-19 |
| 10224241 |
Copper interconnect structure with manganese oxide barrier layer |
Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha |
2019-03-05 |
| 10217809 |
Method of forming resistors with controlled resistivity |
Chih-Chao Yang |
2019-02-26 |
| 10211280 |
Method of forming tunable resistor with curved resistor elements |
Chih-Chao Yang |
2019-02-19 |
| 10211279 |
Tunable resistor with curved resistor elements |
Chih-Chao Yang |
2019-02-19 |
| 10211148 |
Structural enhancement of Cu nanowires |
Chih-Chao Yang |
2019-02-19 |
| 10204856 |
Interconnect structures with fully aligned vias |
Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath |
2019-02-12 |
| 10177089 |
Advanced E-fuse structure with controlled microstructure |
Chih-Chao Yang |
2019-01-08 |
| 10177092 |
Formation of advanced interconnects |
Chih-Chao Yang |
2019-01-08 |
| 10170424 |
Cobalt first layer advanced metallization for interconnects |
Chih-Chao Yang |
2019-01-01 |
