Issued Patents 2019
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446496 | Self-forming barrier for cobalt interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2019-10-15 |
| 10431544 | Self-forming barrier for cobalt interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2019-10-01 |
| 10366940 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Christopher J. Penny, Deepika Priyadarshini | 2019-07-30 |
| 10332837 | Enhancing barrier in air gap technology | Wei Lin | 2019-06-25 |
| 10325806 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2019-06-18 |
| 10276500 | Enhancing barrier in air gap technology | Wei Lin | 2019-04-30 |
| 10256171 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Christopher J. Penny, Deepika Priyadarshini | 2019-04-09 |
| 10256191 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Michael Rizzolo | 2019-04-09 |
| 10242933 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Christopher J. Penny, Deepika Priyadarshini | 2019-03-26 |
| 10229851 | Self-forming barrier for use in air gap formation | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2019-03-12 |
| 10224283 | Composite manganese nitride / low-k dielectric cap | Donald F. Canaperi, Son V. Nguyen, Deepika Priyadarshini | 2019-03-05 |
| 10224241 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2019-03-05 |
| 10204829 | Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers | Hari Prasad Amanapu, Cornelius Brown Peethala, Raghuveer R. Patlolla, Chih-Chao Yang | 2019-02-12 |
| 10192829 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Deepika Priyadarshini, Michael Rizzolo | 2019-01-29 |
| 10177076 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Christopher J. Penny, Deepika Priyadarshini | 2019-01-08 |