Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319629 | Skip via for metal interconnects | Chih-Chao Yang, Lawrence A. Clevenger, Brent A. Anderson | 2019-06-11 |
| 10256191 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo | 2019-04-09 |
| 10243020 | Structures and methods for embedded magnetic random access memory (MRAM) fabrication | Lawrence A. Clevenger, Michael Rizzolo, Theodorus E. Standaert | 2019-03-26 |
| 10211155 | Reducing metallic interconnect resistivity through application of mechanical strain | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Theodorus E. Standaert | 2019-02-19 |