WL

Wei Lin

IBM: 5 patents #1,225 of 11,143Top 15%
📍 Taichung, NY: #4 of 10 inventorsTop 40%
Overall (2019): #28,485 of 560,194Top 6%
5
Patents 2019

Issued Patents 2019

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
10332837 Enhancing barrier in air gap technology Takeshi Nogami 2019-06-25
10276500 Enhancing barrier in air gap technology Takeshi Nogami 2019-04-30
10269760 Advanced chip to wafer stacking Spyridon Skordas 2019-04-23
10211178 Semiconductor device including built-in crack-arresting film structure Leathen Shi, Spyridon Skordas, Kevin R. Winstel 2019-02-19
10170447 Advanced chip to wafer stacking Spyridon Skordas 2019-01-01