Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373909 | Selective surface modification of interconnect structures | Raghuveer R. Patlolla, Roger A. Quon, Chih-Chao Yang | 2019-08-06 |
| 10373867 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Raghuveer R. Patlolla, Chih-Chao Yang | 2019-08-06 |
| 10366879 | Dry and wet etch resistance for atomic layer deposited TiO2 for SIT spacer application | Ekmini Anuja De Silva, Abraham Arceo de la Pena | 2019-07-30 |
| 10361119 | Enlarged contact area structure using noble metal cap and noble metal liner | Koichi Motoyama, Chih-Chao Yang, James J. Kelly | 2019-07-23 |
| 10290541 | Barrier layers in trenches and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang | 2019-05-14 |
| 10276434 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Lawrence A. Clevenger | 2019-04-30 |
| 10242909 | Wet etch removal of Ru selective to other metals | Benjamin D. Briggs, David L. Rath | 2019-03-26 |
| 10242872 | Rework of patterned dielectric and metal hardmask films | John C. Arnold, Prasad Bhosale, Donald F. Canaperi, Raghuveer R. Patlolla, Hosadurga Shobha +1 more | 2019-03-26 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, David L. Rath, Chih-Chao Yang | 2019-02-19 |
| 10204829 | Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers | Hari Prasad Amanapu, Raghuveer R. Patlolla, Chih-Chao Yang, Takeshi Nogami | 2019-02-12 |
| 10204828 | Enabling low resistance gates and contacts integrated with bilayer dielectrics | Ruqiang Bao, Benjamin D. Briggs, Lawrence A. Clevenger, Koichi Motoyama, Michael Rizzolo +1 more | 2019-02-12 |
| 10177030 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Raghuveer R. Patlolla, Chih-Chao Yang | 2019-01-08 |