Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361117 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo | 2019-07-23 |
| 10325806 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2019-06-18 |
| 10312140 | Dielectric gap fill evaluation for integrated circuits | Isabel Cristina Chu, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Ekmini Anuja De Silva, Gauri Karve +3 more | 2019-06-04 |
| 10256185 | Nitridization for semiconductor structures | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang, Chih-Chao Yang | 2019-04-09 |
| 10242872 | Rework of patterned dielectric and metal hardmask films | John C. Arnold, Prasad Bhosale, Donald F. Canaperi, Raghuveer R. Patlolla, Cornelius Brown Peethala +1 more | 2019-03-26 |
| 10242865 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Thomas J. Haigh, Jr., Son V. Nguyen, Deepika Priyadarshini | 2019-03-26 |
| 10236176 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Thomas J. Haigh, Jr., Son V. Nguyen, Deepika Priyadarshini | 2019-03-19 |
| 10224241 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2019-03-05 |