Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366952 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2019-07-30 |
| 10361117 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2019-07-23 |
| 10229967 | High-density MIM capacitors | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2019-03-12 |
| 10217664 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Koichi Motoyama, Wei Wang, Chih-Chao Yang | 2019-02-26 |
| 10211101 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Koichi Motoyama, Wei Wang, Chih-Chao Yang | 2019-02-19 |