Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10428428 | Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same | Alfred Grill, Son V. Nguyen | 2019-10-01 |
| 10381348 | Structure and method for equal substrate to channel height between N and P fin-FETs | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie +2 more | 2019-08-13 |
| 10366940 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny | 2019-07-30 |
| 10325806 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2019-06-18 |
| 10256171 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny | 2019-04-09 |
| 10242865 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha | 2019-03-26 |
| 10242933 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny | 2019-03-26 |
| 10236176 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha | 2019-03-19 |
| 10229910 | Separate N and P fin etching for reduced CMOS device leakage | Isabel Cristina Chu, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve +3 more | 2019-03-12 |
| 10224283 | Composite manganese nitride / low-k dielectric cap | Donald F. Canaperi, Son V. Nguyen, Takeshi Nogami | 2019-03-05 |
| 10224241 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2019-03-05 |
| 10211047 | Multilayer dielectric structures with graded composition for nano-scale semiconductor devices | Son V. Nguyen | 2019-02-19 |
| 10192829 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Michael Rizzolo | 2019-01-29 |
| 10177076 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny | 2019-01-08 |