Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461026 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Christian Lavoie, Stephen M. Rossnagel, Thomas M. Shaw | 2019-10-29 |
| 10192829 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2019-01-29 |