Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461026 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Thomas M. Shaw | 2019-10-29 |
| 10323333 | Feedback control of dimensions in nanopore and nanofluidic devices | Stefan Harrer, Philip S. Waggoner | 2019-06-18 |
| 10316423 | Feedback control of dimensions in nanopore and nanofluidic devices | Stefan Harrer, Philip S. Waggoner | 2019-06-11 |
| 10267784 | DNA sequencing using multiple metal layer structure with different organic coatings forming different transient bondings to DNA | Ali Afzali-Ardakani, Stefan Harrer, Binquan Luan, Hongbo Peng, Ajay K. Royyuru +2 more | 2019-04-23 |