Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10467586 | Blockchain ledgers of material spectral signatures for supply chain integrity management | Prabhakar Kudva, Deborah A. Neumayer | 2019-11-05 |
| 10340182 | Enhanced via fill material and processing for dual damscene integration | James P. Doyle, Geraud Jean-Michel Dubois, Teddie Peregrino Magbitang, Robert D. Miller, Sampath Purushothaman +1 more | 2019-07-02 |
| 10325998 | High selectivity nitride removal process based on selective polymer deposition | Ravi K. Dasaka, Sebastian U. Engelmann, Masahiro Nakamura, Richard S. Wise | 2019-06-18 |
| 10269924 | High selectivity nitride removal process based on selective polymer deposition | Ravi K. Dasaka, Sebastian U. Engelmann, Masahiro Nakamura, Richard S. Wise | 2019-04-23 |
| 10216486 | Automatic generation of license terms for service application marketplaces | Jim A. Laredo, Hui Lei, Sriram Rajagopal, Maja Vukovic, Liangzhao Zeng | 2019-02-26 |
| 10204856 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath | 2019-02-12 |