SP

Sampath Purushothaman

IBM: 1 patents #5,496 of 11,143Top 50%
📍 Yorktown Heights, NY: #99 of 185 inventorsTop 55%
🗺 New York: #5,008 of 13,137 inventorsTop 40%
Overall (2019): #283,214 of 560,194Top 55%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10340182 Enhanced via fill material and processing for dual damscene integration James P. Doyle, Geraud Jean-Michel Dubois, Nicholas C. M. Fuller, Teddie Peregrino Magbitang, Robert D. Miller +1 more 2019-07-02