Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361364 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Sebastian Naczas, Michael Rizzolo, Chih-Chao Yang | 2019-07-23 |
| 10249754 | Precise junction placement in vertical semiconductor devices using etch stop layers | Huiming Bu, Siyuranga O. Koswatta, Junli Wang | 2019-04-02 |
| 10224429 | Precise junction placement in vertical semiconductor devices using etch stop layers | Huiming Bu, Siyuranga O. Koswatta, Junli Wang | 2019-03-05 |