Issued Patents 2019
Showing 26–50 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373867 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2019-08-06 |
| 10373866 | Method of forming metal insulator metal capacitor with extended capacitor plates | Theodorus E. Standaert | 2019-08-06 |
| 10361119 | Enlarged contact area structure using noble metal cap and noble metal liner | Koichi Motoyama, James J. Kelly, Cornelius Brown Peethala | 2019-07-23 |
| 10361115 | Reducing contact resistance in vias for copper interconnects | Conal E. Murray | 2019-07-23 |
| 10361364 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Michael Rizzolo | 2019-07-23 |
| 10361265 | Precision BEOL resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang | 2019-07-23 |
| 10361153 | Surface nitridation in metal interconnects | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang | 2019-07-23 |
| 10355094 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-07-16 |
| 10347825 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Joe Lee, Christopher J. Penny, Michael Rizzolo | 2019-07-09 |
| 10340330 | Precision BEOL resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang | 2019-07-02 |
| 10332956 | Precision beol resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang | 2019-06-25 |
| 10332955 | Precision BEOL resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang | 2019-06-25 |
| 10325978 | Resistors with controlled resistivity | Daniel C. Edelstein | 2019-06-18 |
| 10319629 | Skip via for metal interconnects | Lawrence A. Clevenger, Brent A. Anderson, Nicholas Anthony Lanzillo | 2019-06-11 |
| 10312434 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Joe Lee, Christopher J. Penny, Michael Rizzolo | 2019-06-04 |
| 10308999 | Iron-based alloy coating and method for manufacturing the same | Li-Shing Chou, Yen-Yu HOU, Yi-Tsung Pan | 2019-06-04 |
| 10312181 | Advanced through substrate via metallization in three dimensional semiconductor integration | Daniel C. Edelstein | 2019-06-04 |
| 10304695 | Self-formed liner for interconnect structures | — | 2019-05-28 |
| 10303829 | Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance | Prasad Bhosale, Michael Rizzolo | 2019-05-28 |
| 10304773 | Low resistance contact structures including a copper fill for trench structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-05-28 |
| 10304841 | Metal FinFET anti-fuse | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten, Miaomiao Wang | 2019-05-28 |
| 10297750 | Wraparound top electrode line for crossbar array resistive switching device | Takashi Ando, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo | 2019-05-21 |
| 10297569 | Method of forming a three-dimensional bonded semiconductor structure having nitridized oxide regions | Daniel C. Edelstein | 2019-05-21 |
| 10290541 | Barrier layers in trenches and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo | 2019-05-14 |
| 10283583 | 3D resistor structure with controlled resistivity | Daniel C. Edelstein | 2019-05-07 |