Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157787 | Method and apparatus for depositing cobalt in a feature | Jin-Hee Park, Tae Hong Ha, Sang-Hyeob Lee, Thomas Jongwan Kwon, Jaesoo Ahn +2 more | 2018-12-18 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2018-10-23 |
| 10109481 | Aluminum-nitride buffer and active layers by physical vapor deposition | Mingwei Zhu, Nag B. Patibandla, Rongjun Wang, Vivek Agrawal, Anantha K. Subramani +1 more | 2018-10-23 |
| 10096455 | Extended dark space shield | Thanh X. Nguyen, Rongjun Wang, Muhammad M. Rasheed | 2018-10-09 |
| 10096725 | Method for graded anti-reflective coatings by physical vapor deposition | Yong Cao, Daniel Lee Diehl, Rongjun Wang, TAI-CHOU PAPO CHEN, Tingjun Xu | 2018-10-09 |
| 10060024 | Sputtering target for PVD chamber | Zhendong Liu, Rongjun Wang, Srinivas Gandikota, Tza-Jing Gung, Muhammad M. Rasheed | 2018-08-28 |
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2018-08-14 |
| 10043670 | Systems and methods for low resistivity physical vapor deposition of a tungsten film | Jothilingam Ramalingam, Thanh X. Nguyen, Zhiyong Wang, Jianxin Lei | 2018-08-07 |
| 10014179 | Methods for forming cobalt-copper selective fill for an interconnect | Rong Tao, Tae Hong Ha, Joung Joo Lee | 2018-07-03 |
| 9984976 | Interconnect structures and methods of formation | Yana Cheng, Yong Cao, Srinivas Guggilla, Sree Rangasai V. Kesapragada, Deenesh Padhi | 2018-05-29 |
| 9953813 | Methods and apparatus for improved metal ion filtering | Joung Joo Lee, Guojun Liu | 2018-04-24 |