Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109481 | Aluminum-nitride buffer and active layers by physical vapor deposition | Mingwei Zhu, Rongjun Wang, Vivek Agrawal, Anantha K. Subramani, Daniel Lee Diehl +1 more | 2018-10-23 |
| 10032827 | Systems and methods for transfer of micro-devices | Mingwei Zhu, Sivapackia Ganapathiappan, Boyi Fu, Hou T. Ng | 2018-07-24 |
| 10016877 | Printed chemical mechanical polishing pad having abrasives therein and system for printing | Kasiraman Krishnan, Periya Gopalan | 2018-07-10 |
| 9873180 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Fred C. Redeker +4 more | 2018-01-23 |