Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10086500 | Method of manufacturing a UV curable CMP polishing pad | Mahendra C. ORILALL, Rajeev Bajaj | 2018-10-02 |
| 9911664 | Substrate features for inductive monitoring of conductive trench depth | Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more | 2018-03-06 |
| 9873180 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more | 2018-01-23 |