Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2018-10-23 |
| 9984976 | Interconnect structures and methods of formation | Yong Cao, Srinivas Guggilla, Sree Rangasai V. Kesapragada, Xianmin Tang, Deenesh Padhi | 2018-05-29 |