Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2018-10-23 |
| 10074534 | Ultra-conformal carbon film deposition | Swayambhu Prasad Behera, Shahid Shaikh, Pramit Manna, Mandar B. Pandit, Tersem Summan +4 more | 2018-09-11 |
| 10074559 | Selective poreseal deposition prevention and residue removal using SAM | Geetika Bajaj, Tapash Chakraborty, Prerna Goradia, Robert Jan Visser, Bhaskar Kumar | 2018-09-11 |
| 10049921 | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor | Nerissa Draeger, Kaihan Ashtiani, Derek Wong, Bart J. van Schravendijk, George Andrew Antonelli +3 more | 2018-08-14 |
| 10014174 | Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning | Bencherki Mebarki, Pramit Manna, Li Yan Miao, Bok Hoen Kim, Christopher Dennis Bencher | 2018-07-03 |
| 9984976 | Interconnect structures and methods of formation | Yana Cheng, Yong Cao, Srinivas Guggilla, Sree Rangasai V. Kesapragada, Xianmin Tang | 2018-05-29 |
| 9966299 | Inhibitor plasma mediated atomic layer deposition for seamless feature fill | Wei Tang, Bart J. van Schravendijk, Jun Qian, Hu Kang, Adrien LaVoie +1 more | 2018-05-08 |