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Methods for depositing dielectric barrier layers and aluminum containing etch stop layers |
Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more |
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| 10074534 |
Ultra-conformal carbon film deposition |
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| 10074559 |
Selective poreseal deposition prevention and residue removal using SAM |
Geetika Bajaj, Tapash Chakraborty, Prerna Goradia, Robert Jan Visser, Bhaskar Kumar |
2018-09-11 |
| 10049921 |
Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor |
Nerissa Draeger, Kaihan Ashtiani, Derek Wong, Bart J. van Schravendijk, George Andrew Antonelli +3 more |
2018-08-14 |
| 10014174 |
Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning |
Bencherki Mebarki, Pramit Manna, Li Yan Miao, Bok Hoen Kim, Christopher Dennis Bencher |
2018-07-03 |
| 9984976 |
Interconnect structures and methods of formation |
Yana Cheng, Yong Cao, Srinivas Guggilla, Sree Rangasai V. Kesapragada, Xianmin Tang |
2018-05-29 |
| 9966299 |
Inhibitor plasma mediated atomic layer deposition for seamless feature fill |
Wei Tang, Bart J. van Schravendijk, Jun Qian, Hu Kang, Adrien LaVoie +1 more |
2018-05-08 |
