Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, William J. Lambert +6 more | 2017-12-12 |
| 9795038 | Electronic package design that facilitates shipping the electronic package | Omkar G. Karhade, Nachiket R. Raravikar | 2017-10-17 |
| 9754890 | Embedded multi-device bridge with through-bridge conductive via signal connection | Omkar G. Karhade | 2017-09-05 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Edvin Cetegen, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Shawna M. Liff | 2017-07-25 |
| 9713255 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, John S. Guzek | 2017-07-18 |
| 9691711 | Method of making an electromagnetic interference shield for semiconductor chip packages | Ravindranath V. Mahajan, John S. Guzek, Adel A. Elsherbini | 2017-06-27 |
| 9685421 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Ravindranath V. Mahajan, Omkar G. Karhade | 2017-06-20 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa | 2017-06-20 |
| 9659899 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li +2 more | 2017-05-23 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2017-03-28 |
| 9583470 | Electronic device with solder pads including projections | Omkar G. Karhade | 2017-02-28 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Bassam M. Ziadeh, Yoshihiro Tomita | 2017-02-21 |