BP

Balasubramanian Pranatharthiharan

IBM: 27 patents #84 of 10,295Top 1%
Globalfoundries: 12 patents #45 of 2,145Top 3%
SS Stmicroelectronics Sa: 2 patents #43 of 162Top 30%
🗺 California: #106 of 57,791 inventorsTop 1%
Overall (2016): #521 of 481,213Top 1%
31
Patents 2016

Issued Patents 2016

Showing 1–25 of 31 patents

Patent #TitleCo-InventorsDate
9530890 Parasitic capacitance reduction Junli Wang 2016-12-27
9520500 Self heating reduction for analog radio frequency (RF) device Injo Ok, Charan V. Surisetty, Soon-Cheon Seo, Tenko Yamashita 2016-12-13
9515163 Methods of forming FinFET semiconductor devices with self-aligned contact elements using a replacement gate process and the resulting devices Ruilong Xie, Shom Ponoth 2016-12-06
9508816 Low resistance replacement metal gate structure Injo Ok, Charan V. Surisetty 2016-11-29
9502418 Semiconductor devices with sidewall spacers of equal thickness Kangguo Cheng, Soon-Cheon Seo 2016-11-22
9496133 Method to prevent lateral epitaxial growth in semiconductor devices by performing nitridation process on exposed Fin ends Hui Zang 2016-11-15
9484401 Capacitance reduction for advanced technology nodes Injo Ok, Charan V. Surisetty 2016-11-01
9472616 Undercut insulating regions for silicon-on-insulator device Kangguo Cheng, Bruce B. Doris, Shom Ponoth, Theodorus E. Standaert, Tenko Yamashita 2016-10-18
9472447 Confined eptaxial growth for continued pitch scaling Sivananda K. Kanakasabapathy 2016-10-18
9466680 Integrated multiple gate length semiconductor device including self-aligned contacts Su Chen Fan, Rajasekhar Venigalla 2016-10-11
9461168 Channel strain and controlling lateral epitaxial growth of the source and drain in FinFET devices Injo Ok, Soon-Cheon Seo, Charan V. Surisetty 2016-10-04
9443738 Integrated circuits with middle of line capacitance reduction in self-aligned contact process flow and fabrication methods Hui Zang 2016-09-13
9443944 Integrated circuits with middle of line capacitance reduction in self-aligned contact process flow and fabrication methods Hui Zang 2016-09-13
9443853 Minimizing shorting between FinFET epitaxial regions Kangguo Cheng, Alexander Reznicek, Charan V. Surisetty 2016-09-13
9437504 Method for the formation of fin structures for FinFET devices Nicolas Loubet, Prasanna Khare, Qing Liu, Shom Ponoth 2016-09-06
9431486 Channel strain and controlling lateral epitaxial growth of the source and drain in FinFET devices Injo Ok, Soon-Cheon Seo, Charan V. Surisetty 2016-08-30
9431399 Method for forming merged contact for semiconductor device Emre Alptekin, Sivananda K. Kanakasabapathy, Ravikumar Ramachandran, Mickey H. Yu 2016-08-30
9425108 Method to prevent lateral epitaxial growth in semiconductor devices Hui Zang 2016-08-23
9419097 Replacement metal gate dielectric cap Damon B. Farmer, Michael A. Guillorn, George S. Tulevski 2016-08-16
9418902 Forming isolated fins from a substrate Kangguo Cheng, Shom Ponoth, Theodorus E. Standaert, Tenko Yamashita 2016-08-16
9406767 POC process flow for conformal recess fill Andrew M. Greene, Sanjay C. Mehta, Ruilong Xie 2016-08-02
9406568 Semiconductor structure containing low-resistance source and drain contacts Injo Ok, Charan V. Surisetty 2016-08-02
9397006 Co-integration of different fin pitches for logic and analog devices Injo Ok, Soon-Cheon Seo, Charan V. Surisetty 2016-07-19
9349598 Gate contact with vertical isolation from source-drain David V. Horak, Shom Ponoth, Ruilong Xie 2016-05-24
9337094 Method of forming contact useful in replacement metal gate processing and related semiconductor structure Injo Ok, Charan V. Surisetty 2016-05-10