| 11635974 |
Providing a different configuration of added functionality for each of the stages of predeployment, deployment, and post deployment using a layer of abstraction |
Ariel Cohen, Javier Espeche, Jonathan Lopez Lopez |
2023-04-25 |
| 11449348 |
Pre/post deployment customization |
Ariel Cohen, Javier Espeche, Jonathan Lopez Lopez |
2022-09-20 |
| 11333707 |
Testing of integrated circuits during at-speed mode of operation |
Khushboo Agarwal, Sanjay Krishna Hulical Vijayaraghavachar, Raashid Moin Shaikh, Srivaths Ravi, Wilson Pradeep |
2022-05-17 |
| 10521243 |
Pre/post deployment customization |
Ariel Cohen, Javier Espeche, Jonathan Lopez Lopez |
2019-12-31 |
| 10471567 |
CMP pad conditioning assembly |
Patrick J. Doering, Andrew Galpin |
2019-11-12 |
| 9972402 |
Continuous write and read operations for memories with latencies |
Nishi Bhushan Singh, Ashutosh Anand, Anand Bhat, Shankarnarayan Bhat |
2018-05-15 |
| 9971663 |
Method and apparatus for multiple memory shared collar architecture |
Nishi Bhushan Singh, Anand Bhat, Ashutosh Anand, Abhinav Kothiala |
2018-05-15 |
| 8856601 |
Scan compression architecture with bypassable scan chains for low test mode power |
Srivaths Ravi, Rubin Ajit Parekhji |
2014-10-07 |
| 8618661 |
Die having coefficient of thermal expansion graded layer |
Brian K. Kirkpatrick |
2013-12-31 |
| 8205125 |
Enhanced control in scan tests of integrated circuits with partitioned scan chains |
Alan Hales, Srujan Kumar Nakidi, Rubin Ajit Parekhji, Srivaths Ravi |
2012-06-19 |
| 7519905 |
Automatic formatting and validating of text for a markup language graphical user interface |
Panagiotis Kougiouris, Chip Bering |
2009-04-14 |
| 7387960 |
Dual depth trench termination method for improving Cu-based interconnect integrity |
Russell Fields, Scott A. Boddicker, Andrew Tae Kim |
2008-06-17 |
| 7010381 |
Versatile system for controlling semiconductor topography |
Nital S. Patel |
2006-03-07 |
| 6941242 |
Versatile system for variance-based data analysis |
Nital S. Patel |
2005-09-06 |
| 6709974 |
Method of preventing seam defects in isolated lines |
David Permana, Jiong-Ping Lu, Albert Cheng, Jeff West, Brock W. Fairchild +3 more |
2004-03-23 |
| 6573173 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process |
János Farkas, Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta +2 more |
2003-06-03 |
| 6444569 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process |
János Farkas, Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta +2 more |
2002-09-03 |
| 6274478 |
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process |
János Farkas, Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta +2 more |
2001-08-14 |
