Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12002846 | Integrated circuits having dielectric layers including an anti-reflective coating | Poornika Fernandes, David M. Curran, Stephen Arlon Meisner, Bhaskar Srinivasan, Guruvayurappan Mathur +3 more | 2024-06-04 | $36,059,000 |
| 11171200 | Integrated circuits having dielectric layers including an anti-reflective coating | Poornika Fernandes, David M. Curran, Stephen Arion Meisner, Bhaskar Srinivasan, Guruvayurappan Mathur +3 more | 2021-11-09 | $35,109,000 |
| 7387960 | Dual depth trench termination method for improving Cu-based interconnect integrity | Rajesh Tiwari, Scott A. Boddicker, Andrew Tae Kim | 2008-06-17 | $14,039,000 |