Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7387960 | Dual depth trench termination method for improving Cu-based interconnect integrity | Rajesh Tiwari, Russell Fields, Andrew Tae Kim | 2008-06-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7387960 | Dual depth trench termination method for improving Cu-based interconnect integrity | Rajesh Tiwari, Russell Fields, Andrew Tae Kim | 2008-06-17 |