Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7387960 | Dual depth trench termination method for improving Cu-based interconnect integrity | Rajesh Tiwari, Russell Fields, Andrew Tae Kim | 2008-06-17 | $14,039,000 |