Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12265258 | Structures and methods for high speed interconnection in photonic systems | Weiwei Song, Stefan Rusu | 2025-04-01 |
| 12223247 | Logic cell structures and related methods | Kumar Lalgudi, Ranjith Kumar, Jianyang Xu | 2025-02-11 |
| 12181724 | Apparatus and methods for optical interconnects | Stefan Rusu, Wei-wei SONG, Chih-Tsung Shih | 2024-12-31 |
| 12092862 | Photonic semiconductor device and method | Stefan Rusu, Weiwei Song | 2024-09-17 |
| 12046580 | Three-dimensional integrated circuit (3D IC) low-dropout (LDO) regulator power delivery | Stefan Rusu, Eric Soenen | 2024-07-23 |
| 11966090 | Heterogeneous packaging integration of photonic and electronic elements | Stefan Rusu, Wei-wei SONG | 2024-04-23 |
| 11816412 | Logic cell structures and related methods | Kumar Lalgudi, Ranjith Kumar, Jianyang Xu | 2023-11-14 |
| 11808977 | Structures and methods for high speed interconnection in photonic systems | Weiwei Song, Stefan Rusu | 2023-11-07 |
| 11703639 | Photonic semiconductor device and method | Stefan Rusu, Weiwei Song | 2023-07-18 |
| 11550102 | Structures and methods for high speed interconnection in photonic systems | Weiwei Song, Stefan Rusu | 2023-01-10 |
| 11215753 | Photonic semiconductor device and method | Stefan Rusu, Weiwei Song | 2022-01-04 |
| 7894517 | Self-calibrated adaptive equalization system and methods of performing the same | Hao Liu, Yanli Fan, Mark W. Morgan | 2011-02-22 |
| 6573173 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Brian G. Anthony, Abbas Guvenilir, Venkat R. Kolagunta, John Mendonca +2 more | 2003-06-03 |
| 6551919 | Method for forming a dual inlaid copper interconnect structure | Suresh Venkatesan, Bradley P. Smith | 2003-04-22 |
| 6444569 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Brian G. Anthony, Abbas Guvenilir, Venkat R. Kolagunta, John Mendonca +2 more | 2002-09-03 |
| 6326301 | Method for forming a dual inlaid copper interconnect structure | Suresh Venkatesan, Bradley P. Smith | 2001-12-04 |
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Cindy Reidsema Simpson, Robert D. Mikkola, Matthew T. Herrick, Brett Baker, David Moralez Pena +4 more | 2001-10-02 |
| 6274478 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Brian G. Anthony, Abbas Guvenilir, Venkat R. Kolagunta, John Mendonca +2 more | 2001-08-14 |