Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446436 | In-line protection from process induced dielectric damage | William E. Edwards | 2019-10-15 |
| 6713381 | Method of forming semiconductor device including interconnect barrier layers | Alexander L. Barr, Suresh Venkatesan, David B. Clegg, Rebecca G. Cole, Olubunmi O. Adetutu +5 more | 2004-03-30 |
| 6573173 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2003-06-03 |
| 6451181 | Method of forming a semiconductor device barrier layer | Dean J. Denning, Sam S. Garcia, Bradley P. Smith, Daniel J. Loop, Gregory N. Hamilton +1 more | 2002-09-17 |
| 6444569 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2002-09-03 |
| 6274478 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2001-08-14 |