Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793106 | Reliability improvement of polymer-based capacitors by moisture barrier | Honglin Guo, Tim A. Taylor, Ricky Alan Jackson, Byron Lovell Williams | 2017-10-17 |
| 8471577 | Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate | Daniel Stillman, James L. Oborny, William John Antheunisse, Norman J. Armendariz, Ramyanshu Datta +1 more | 2013-06-25 |
| 6872665 | Process flow for dual damescene interconnect structures | Francis G. Celii, Guoqiang Xing, Andrew John McKerrow, Andrew Ralston, Zhicheng Tang +2 more | 2005-03-29 |
| 6709974 | Method of preventing seam defects in isolated lines | David Permana, Jiong-Ping Lu, Albert Cheng, Brock W. Fairchild, Scott Alexander JOHANNESMEYER +3 more | 2004-03-23 |