Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8014320 | Method for discovering the physical topology of a telecommunications network | Vinicius Garcia de Oliveira, Marcos Rogério Salvador | 2011-09-06 |
| 7965621 | Method and arrangement for failure handling in a network | Csaba Antal, Lars Westberg | 2011-06-21 |
| 7951729 | Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device | Srdjan Kordic, Cindy Goldberg | 2011-05-31 |
| 7939482 | Cleaning solution for a semiconductor wafer | — | 2011-05-10 |
| 7883393 | System and method for removing particles from a polishing pad | Srdjan Kordic, Sebastien Petitdidier, Silvio Del Monaco | 2011-02-08 |
| 7804791 | Method of generating spanning trees to handle link and node failures in a network | Tóth Gábor | 2010-09-28 |
| 7803719 | Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device | Maria Luisa Calvo-Munoz, Srdjan Kordic | 2010-09-28 |
| 7691756 | Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device | Srdjan Kordic, Cindy Goldberg | 2010-04-06 |
| 7674725 | Treatment solution and method of applying a passivating layer | Sebastien Petitdidier | 2010-03-09 |
| 7660242 | Call admission control system and method for interpreting signaling messages and controlling traffic load in internet protocol differentiated services networks | Gergely Matefi, Csaba Antal | 2010-02-09 |
| 7456105 | CMP metal polishing slurry and process with reduced solids concentration | Kevin Cooper, Jennifer L. Cooper, John C. Flake, Johannes Groschopf, Yuri Solomentsev | 2008-11-25 |
| 7176574 | Semiconductor device having a multiple thickness interconnect | Kathleen C. Yu, Kirk Strozewski, Hector Sanchez, Yeong-Jyh T. Lii | 2007-02-13 |
| 6815820 | Method for forming a semiconductor interconnect with multiple thickness | Kathleen C. Yu, Kirk Strozewski, Hector Sanchez, Yeong-Jyh T. Lii | 2004-11-09 |
| 6573173 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2003-06-03 |
| 6444569 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2002-09-03 |
| 6313024 | Method for forming a semiconductor device | Nigel G. Cave, Kathleen C. Yu | 2001-11-06 |
| 6274478 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2001-08-14 |
| 6204169 | Processing for polishing dissimilar conductive layers in a semiconductor device | Rajeev Bajaj, Sung-Cheol Kim, Jaime Saravia | 2001-03-20 |
| 6096652 | Method of chemical mechanical planarization using copper coordinating ligands | David Watts, Jason Aquinde GOMEZ, Chelsea Dang | 2000-08-01 |
| 6037668 | Integrated circuit having a support structure | Nigel G. Cave, Kathleen C. Yu | 2000-03-14 |
| 6001730 | Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers | Rajeev Bajaj, Melissa Freeman, David Watts, Sanjit Das | 1999-12-14 |
| 5935871 | Process for forming a semiconductor device | David Watts, Melissa Freeman | 1999-08-10 |
| 5928962 | Process for forming a semiconductor device | Sanjit Das, George R. Meyer | 1999-07-27 |
| 5897375 | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture | David Watts, Rajeev Bajaj, Sanjit Das, Chelsea Dang, Melissa Freeman +3 more | 1999-04-27 |
| 5863838 | Method for chemically-mechanically polishing a metal layer | Melissa Freeman | 1999-01-26 |