Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8779281 | Solar cell | Yen-Cheng Hu, Peng Chen, Tsung-Pao Chen, Shuo-Wei Liang, Chien-Jen Chen | 2014-07-15 |
| 8653664 | Barrier layers for copper interconnect | Nai-Wei Liu, Cheng-Lin Huang, Po-Hsiang Huang, Yung-Chih Wang, Shu-Hui Su +2 more | 2014-02-18 |
| 8456009 | Semiconductor structure having an air-gap region and a method of manufacturing the same | Shu-Hui Su, Cheng-Lin Huang, Jiing-Feng Yang, Ren-Guei Wu, Dian-Hau Chen +1 more | 2013-06-04 |
| 8338217 | Method of fabricating a solar cell | Yen-Cheng Hu, Cheng-Chang Kuo, Jun-Wei Chen, Hsin-Feng Li, Jen-Chieh Chen | 2012-12-25 |
| 8334163 | Method of forming solar cell | Yen-Cheng Hu, Jen-Chieh Chen | 2012-12-18 |
| 8084328 | Semiconductor device including I/O oxide nitrided core oxide on substrate | Yung-Cheng Lu, Pi-Tsung Chen, Ying-Tsung Chen | 2011-12-27 |
| 7834405 | Semiconductor device including I/O oxide and nitrided core oxide on substrate | Yung-Cheng Lu, Pi-Tsung Chen, Ying-Tsung Chen | 2010-11-16 |
| 7732923 | Impurity doped UV protection layer | Yung-Cheng Lu, Chung-Chi Ko | 2010-06-08 |
| 7485949 | Semiconductor device | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Shwang-Ming Jeng | 2009-02-03 |
| 7465676 | Method for forming dielectric film to improve adhesion of low-k film | Fang Wen Tsai, I-I Chen, Chih-Lung Lin, Tien-I Bao, Shwang-Ming Jeng +1 more | 2008-12-16 |
| 7259090 | Copper damascene integration scheme for improved barrier layers | Yung-Cheng Lu | 2007-08-21 |
| 7253524 | Copper interconnects | Tzu-Jen Chou, Weng Chang, Yung-Cheng Lu, Syun-Ming Jang, Mong-Song Liang | 2007-08-07 |
| 7247571 | Method for planarizing semiconductor structures | Ying-Tsung Chen, Yung-Cheng Lu, Pi-Tsung Chen | 2007-07-24 |
| 7217648 | Post-ESL porogen burn-out for copper ELK integration | Yung-Cheng Lu, Ying-Tsung Chen, Pi-Tsung Chen | 2007-05-15 |
| 7196423 | Interconnect structure with dielectric barrier and fabrication method thereof | Ying-Tsung Chen, Yun-Cheng Lu, Syun-Ming Jang | 2007-03-27 |
| 7193325 | Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects | Bi-Troug Chen, Weng Chang, Syun-Ming Jang, Su-Horng Lin | 2007-03-20 |
| 7160800 | Decreasing metal-silicide oxidation during wafer queue time | Cheng-Hung Chang, Yu-Lien Huang, Shwang-Ming Cheng | 2007-01-09 |
| 7151315 | Method of a non-metal barrier copper damascene integration | Yung-Chen Lu, Syun-Ming Jang | 2006-12-19 |
| 7135408 | Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure | Syun-Ming Jang | 2006-11-14 |
| 7115974 | Silicon oxycarbide and silicon carbonitride based materials for MOS devices | Hung Chun Tsai, Da-Wen Lin, Weng Chang, Shwang-Ming Cheng, Mong-Song Liang | 2006-10-03 |
| 7056826 | Method of forming copper interconnects | Yung-Cheng Lu, Ying-Tsung Chen, Syun-Ming Jang | 2006-06-06 |
| 6878621 | Method of fabricating barrierless and embedded copper damascene interconnects | Lain-Jong Li, Yung-Chen Lu, Syun-Ming Jang | 2005-04-12 |
| 6753607 | Structure for improving interlevel conductor connections | Yung-Cheng Lu, Syun-Ming Jang | 2004-06-22 |