Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7193325 | Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects | Zhen-Cheng Wu, Weng Chang, Syun-Ming Jang, Su-Horng Lin | 2007-03-20 |
| 6759342 | Method of avoiding dielectric arcing | Chih-Hsiang Yao, Lain-Jong Li, Syun-Ming Jan | 2004-07-06 |