Issued Patents All Time
Showing 26–50 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107725 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Wei-Chen Chu, Chia-Tien Wu | 2021-08-31 |
| 11101216 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2021-08-24 |
| 11088020 | Structure and formation method of interconnection structure of semiconductor device | Wei-Chen Chu, Li-Lin Su, Shin-Yi Yang, Cheng-Chi Chuang, Hsin-Ping Chen | 2021-08-10 |
| 11011462 | Method for forming fuse pad and bond pad of integrated circuit | Chun-Yi Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang | 2021-05-18 |
| 11004740 | Structure and method for interconnection with self-alignment | Yu-Chieh Liao, Chia-Tien Wu, Hsin-Ping Chen, Hai-Ching Chen, Shau-Lin Shue | 2021-05-11 |
| 10991618 | Semiconductor device and method of manufacture | Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue | 2021-04-27 |
| 10964559 | Wafer etching apparatus and method for controlling etch bath of wafer | Chih-Shen Yang, Tien-Lu Lin | 2021-03-30 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Chia-Tien Wu +2 more | 2021-02-23 |
| 10923424 | Interconnect structure with air-gaps | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2021-02-16 |
| 10867906 | Conductive structures in semiconductor devices | Yu-Chieh Liao, Tien-Lu Lin, Tien-I Bao | 2020-12-15 |
| 10818596 | Method for forming semiconductor device structure with graphene layer | Tien-I Bao, Tien-Lu Lin, Wei-Chen Chu | 2020-10-27 |
| 10818597 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Cheng-Chi Chuang, Tien-Lu Lin | 2020-10-27 |
| 10804143 | Semiconductor structure and method for manufacturing the same | Wei-Chen Chu, Hsin-Ping Chen, Chih Wei Lu, Chung-Ju Lee | 2020-10-13 |
| 10784151 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Wei-Chen Chu, Chia-Tien Wu | 2020-09-22 |
| 10784155 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Cheng-Chi Chuang, Chia-Tien Wu | 2020-09-22 |
| 10763337 | Fabrication of gate all around device | Yung-Chih Wang, Yu-Chieh Liao, Hsin-Ping Chen | 2020-09-01 |
| 10714421 | Structure and formation method of semiconductor device with self-aligned conductive features | Wei-Chen Chu, Yung-Hsu Wu, Chung-Ju Lee | 2020-07-14 |
| 10700005 | Interconnect structure with air gaps | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2020-06-30 |
| 10676351 | Nano-electromechanical system (NEMS) device structure and method for forming the same | Hsin-Ping Chen, Carlos H. Diaz, Ken-Ichi Goto, Shau-Lin Shue | 2020-06-09 |
| 10680078 | Semiconductor arrangement and formation thereof | Tien-Lu Lin, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2020-06-09 |
| 10622453 | Vertical MOS transistor | Yung-Chih Wang, Shin-Yi Yang, Chih Wei Lu, Hsin-Ping Chen, Shau-Lin Shue | 2020-04-14 |
| 10535560 | Interconnection structure of semiconductor device | Wei-Chen Chu, Hsiang-Wei Liu, Chia-Tien Wu | 2020-01-14 |
| 10534273 | Multi-metal fill with self-aligned patterning and dielectric with voids | Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2020-01-14 |
| 10490500 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2019-11-26 |
| 10483159 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Cheng-Chi Chuang, Chia-Tien Wu | 2019-11-19 |