Issued Patents All Time
Showing 51–75 of 337 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9590065 | Semiconductor device with metal gate structure comprising work-function metal layer and work-fuction adjustment layer | Da-Yuan Lee, Kuan-Ting Liu, Hung-Chin Chung, Hsien-Ming Lee, Weng Chang +1 more | 2017-03-07 |
| 9564398 | Chemical direct pattern plating interconnect metallization and metal structure produced by the same | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Mingh-Hsing Tsai | 2017-02-07 |
| 9520362 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Hung-Wen Su, Ming-Hsing Tsai | 2016-12-13 |
| 9515188 | Fin field effect transistors having conformal oxide layers and methods of forming same | Chia-Cheng Chen, Meng-Shu Lin, Liang-Yin Chen, Xiong-Fei Yu, Hui-Cheng Chang | 2016-12-06 |
| 9461144 | Method for semiconductor device fabrication | Ming-Hsi Yeh, Hsin-Yan Lu, Chao-Cheng Chen | 2016-10-04 |
| 9355874 | Silicon nitride etching in a single wafer apparatus | Weibo Yu, Hsueh-Chin Lu, Han-Guan Chew, Kuo-Bin Huang, Chao-Cheng Chen | 2016-05-31 |
| 9281196 | Method to reduce etch variation using ion implantation | Tsan-Chun Wang, Ziwei Fang, Chii-Horng Li, Tze-Liang Lee, Chao-Cheng Chen | 2016-03-08 |
| 9269612 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Hung-Wen Su, Ming-Hsing Tsai | 2016-02-23 |
| 9219036 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Yung-Cheng Lu | 2015-12-22 |
| 9214513 | Fin structure and method for forming the same | Chun-Hsiung Lin, Carlos H. Diaz, Hui-Cheng Chang, Mao-Lin Huang, Chien-Hsun Wang | 2015-12-15 |
| 9214383 | Method of semiconductor integrated circuit fabrication | Wen-Jiun Liu, Chien-An Chen, Ya-Lien Lee, Hung-Wen Su, Minghsing Tsai | 2015-12-15 |
| 9111884 | Finlike structures and methods of making same | Ming-Hsi Yeh, Chao-Cheng Chen | 2015-08-18 |
| 9054130 | Bottle-neck recess in a semiconductor device | Eric Peng, Chao-Cheng Chen, Ming-Hua Yu, Ying Hao Hsieh, Tze-Liang Lee +2 more | 2015-06-09 |
| 9029260 | Gap filling method for dual damascene process | Chun-Chieh Lin, Hung-Wen Su, Minghsing Tsai | 2015-05-12 |
| 8999842 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Yung-Cheng Lu | 2015-04-07 |
| 8962484 | Method of forming pattern for semiconductor device | Chia-Ying Lee, Chih-Yuan Ting, Jyu-Horng Shieh, Minghsing Tsai | 2015-02-24 |
| 8932962 | Chemical dispensing system and method | Weibo Yu, Kuo-Bin Huang, Chao-Cheng Chen | 2015-01-13 |
| 8889502 | Finlike structures and methods of making same | Ming-Hsi Yeh, Chao-Cheng Chen | 2014-11-18 |
| 8822331 | Anchored damascene structures | David Lu, Horng-Huei Tseng | 2014-09-02 |
| 8785324 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Yung-Cheng Lu | 2014-07-22 |
| 8759975 | Approach for reducing copper line resistivity | Hsien-Ming Lee, Minghsing Tsai | 2014-06-24 |
| 8735252 | Method of semiconductor integrated circuit fabrication | Weibo Yu, Ming-Hsi Yeh, Chih-Tang Peng, Hao-Ming Lien, Chao-Cheng Chen | 2014-05-27 |
| 8609484 | Method for forming high-K metal gate device | Lee-Wee Tao, Han-Guan Chew, Harry-Hak-Lay Chuang | 2013-12-17 |
| 8368220 | Anchored damascene structures | David Lu, Horng-Huei Tseng | 2013-02-05 |
| 8330275 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Yung-Cheng Lu | 2012-12-11 |