Issued Patents All Time
Showing 326–350 of 365 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6544882 | Method to improve reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and aluminum-copper-TiN layers in integrated circuits | Chung-Shi Liu, Chen-Hua Yu | 2003-04-08 |
| 6531389 | Method for forming incompletely landed via with attenuated contact resistance | Mei-Yun Wang | 2003-03-11 |
| 6500749 | Method to improve copper via electromigration (EM) resistance | Chung-Shi Liu, Chen-Hua Yu | 2002-12-31 |
| 6492269 | Methods for edge alignment mark protection during damascene electrochemical plating of copper | Chung-Shi Liu, Chen-Hua Yu, Ching-Hua Hsieh | 2002-12-10 |
| 6468873 | MIM formation method on CU damscene | Chung-Shi Liu | 2002-10-22 |
| 6451701 | Method for making low-resistance silicide contacts between closely spaced electrically conducting lines for field effect transistors | Mei-Yun Wang, Shwangming Jeng | 2002-09-17 |
| 6436825 | Method of copper barrier layer formation | — | 2002-08-20 |
| 6417569 | Fluorine-doped silicate glass hard mask to improve metal line etching profile | Chia-Shiung Tsai | 2002-07-09 |
| 6413863 | Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process | Chung-Shi Liu, Chen-Hua Yu | 2002-07-02 |
| 6387800 | Method of forming barrier and seed layers for electrochemical deposition of copper | Chung-Shi Liu | 2002-05-14 |
| 6380056 | Lightly nitridation surface for preparing thin-gate oxides | Jih-Churng Twu | 2002-04-30 |
| 6372645 | Methods to reduce metal bridges and line shorts in integrated circuits | Chung-Shi Liu, Chen-Hua Yu, Shih-Chi Lin, Ming-Jer Lee, Ying-Lang Wang +1 more | 2002-04-16 |
| 6358844 | Tungsten deposition process with dual-step nucleation | Mei-Yun Wang | 2002-03-19 |
| 6353260 | Effective diffusion barrier | Chung-Shi Liu, Chen-Hua Yu | 2002-03-05 |
| 6350688 | Via RC improvement for copper damascene and beyond technology | Chung-Shi Liu, Chen-Hua Yu | 2002-02-26 |
| 6342448 | Method of fabricating barrier adhesion to low-k dielectric layers in a copper damascene process | Jing-Cheng Lin, Chen-Hua Yu | 2002-01-29 |
| 6319822 | Process for forming an integrated contact or via | Chao-Cheng Chen, Chia-Shiung Tsai, Hun-Jan Tao | 2001-11-20 |
| 6297158 | Stress management of barrier metal for resolving CU line corrosion | Chung-Shi Liu, Chen-Hua Yu | 2001-10-02 |
| 6281127 | Self-passivation procedure for a copper damascene structure | — | 2001-08-28 |
| 6277745 | Passivation method of post copper dry etching | Chung-Shi Liu, Syun-Ming Jang, Chen-Hua Yu | 2001-08-21 |
| 6271136 | Multi-step plasma process for forming TiSiN barrier | Chung-Shi Liu | 2001-08-07 |
| 6245675 | 3D reservoir to improve electromigration resistance of tungsten plug | Mong-Song Liang | 2001-06-12 |
| 6242338 | Method of passivating a metal line prior to deposition of a fluorinated silica glass layer | Chung-Shi Liu, Yao-Yi Cheng, Chen-Hua Yu, Mei-Yun Wang | 2001-06-05 |
| 6224737 | Method for improvement of gap filling capability of electrochemical deposition of copper | Ming-Hsing Tsai, Wen-Jye Tsai, Chen-Hua Yu | 2001-05-01 |
| 6221758 | Effective diffusion barrier process and device manufactured thereby | Chung-Shi Liu, Chen-Hua Yu | 2001-04-24 |