Issued Patents All Time
Showing 351–365 of 365 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6211075 | Method of improving metal stack reliability | Chung-Shi Liu, Chen-Hua Yu, Hung-Ju Chien | 2001-04-03 |
| 6207568 | Ionized metal plasma (IMP) method for forming (111) oriented aluminum containing conductor layer | Chung-Shi Liu, Chen-Hua Yu | 2001-03-27 |
| 6197701 | Lightly nitridation surface for preparing thin-gate oxides | Jih-Churng Twu | 2001-03-06 |
| 6177347 | In-situ cleaning process for Cu metallization | Chung-Shi Liu, Chen-Hua Yu | 2001-01-23 |
| 6143617 | Composite capacitor electrode for a DRAM cell | Cheng-Yeh Shih | 2000-11-07 |
| 6140241 | Multi-step electrochemical copper deposition process with improved filling capability | Ming-Hsing Tsai, Wen-Jye Tsai, Chen-Hua Yu | 2000-10-31 |
| 6133144 | Self aligned dual damascene process and structure with low parasitic capacitance | Ming-Hsing Tsai | 2000-10-17 |
| 6110817 | Method for improvement of electromigration of copper by carbon doping | Ming Wsing Tsai | 2000-08-29 |
| 6099701 | AlCu electromigration (EM) resistance | Chung-Shi Liu, Chen-Hua Yu | 2000-08-08 |
| 6096651 | Key-hole reduction during tungsten plug formation | Mei-Yun Wang, Chen-Hua Yu | 2000-08-01 |
| 6083835 | Self-passivation of copper damascene | Chen-Hua Yu | 2000-07-04 |
| 6080657 | Method of reducing AlCu hillocks | Chung-Shi Liu, Chen-Hua Yu | 2000-06-27 |
| 6015735 | Method for forming a multi-anchor DRAM capacitor and capacitor formed | Hun-Jan Tao, Chia-Shiung Tsai, Jenn Ming Huang | 2000-01-18 |
| 5962346 | Fluorine-doped silicate glass hard mask to improve metal line etching profile | Chia-Shiung Tsai | 1999-10-05 |
| 5744395 | Low resistance, self-aligned, titanium silicide structures, using a single rapid thermal anneal procedure | Chen-Hua Yu | 1998-04-28 |